Si Deep Excavation Device 'RIE-800BCT'
Production equipment compatible with 2 reaction chambers and 2 cassettes! Capable of deep Si etching from nano to micro levels.
The RIE-800BCT is a production silicon deep etching device that employs inductively coupled plasma in its discharge method. It enables high-aspect-ratio processing of over 50 and low scallop processing while maintaining a high etching rate and selectivity with resist. Additionally, by rapidly switching gases, it can reduce scallops while maintaining the etching rate. 【Features】 - Capable of deep silicon etching from nano to micro levels - Supports wafers up to 8 inches in diameter - High-aspect-ratio processing of over 50 - Low scallop processing - Extensive process library *For more details, please refer to the PDF document or feel free to contact us.
